中图分类号：TN72 文献标志码：A DOI: 10.16157/j.issn.0258-7998.245672 中文引用格式： 麻泽龙，吴景峰，余小辉. 基于系统级封装技术的X频段变频模块研制[J]. 电子技术应用，2024，50(12)：105-111. 英文引用格式： Ma Zelong，Wu Jingfeng，Yu Xiaohui. Development of X-band RF transceiver module with system in package technology[J]. Application of Electronic Technique，2024，50(12)：105-111.
Development of X-band RF transceiver module with system in package technology
Ma Zelong，Wu Jingfeng，Yu Xiaohui
The 13th Research Institute of China Electronics Technology
Abstract： A miniaturized X-band dual-channel radio frequency(RF) transceiver module is designed by using system in package(SiP) technology, which integrates devices based on a variety of process. Receiving channel and transmitting channel are integrated into a cavity, and time-sharing control for transmitting and receiving is achieved. Double-cavity structure is used and different cavities are vertically interconnected through the ball grid arrays to reduce the module size significantly. The size of SIP module is 21 mm×16 mm×3.8 mm. The main measured technical specifications of the modules are as follows: The P-1dB of receiving channel ≤-10 dBm, receiving signal gain 30～35 dB, isolation degree of the receiving channel ≥55 dB, receiving noise figure ≤8 dB; gain of transmission channel 10～12 dB, maximum output power of transmission channel ≥12 dBm, second and third harmonic suppression ≥60 dBc, clutter rejection ≥55 dBc, the module can function properly within the temperature range of -55～+85 ℃. The measured results are basically agreed with the simulation results.
Key words : X-band；RF transceiver system；system in package；BGA ball grid arrays
引言
系统级封装技术（System in Package，SiP）是将多个具有不同功能的有源电子器件与无源元件等其他器件组装成为可以提供多种功能的单个标准封装件，形成一个系统或者子系统[1]。相较于片上系统（System on Chip，SoC），系统级封装的最大优势就是可以采用具有不同工艺（CMOS、Bi-CMOS等）和封装技术（MCM）的器件制作出具有不同功能（发射接收通道、耦合器、频率源）的系统[2]，充分发挥各工艺的优势，且可以降低研发周期，节约成本[3]。射频SiP是SiP模块的一个重要研究方向[4]，主要基片类型包括硅基、低温共烧陶瓷（Low Temperature Co-fired Ceramic，LTCC）以及多层板等，芯片连接类型包括倒装、芯片层叠，封装类型包括球栅阵列（Ball Grid Array，BGA）、栅格阵列（Land Grid Array，LGA）等[5]。在文献[6]中研究人员设计了一款基于SiP技术工作频段为8~12 GHz的收发模块[6]，内部集成了高功率放大器、低噪声放大器、单片微波集成芯片、单刀双掷开关等器件，不同层间通过接插件连接，尺寸仅为13.8 mm×13.8 mm×6.1 mm。
